Compact and highly efficient dram cell

ABSTRACT

A compact dynamic random access memory (DRAM) cell and highly efficient methods for using the DRAM cell are disclosed. The DRAM cell provides reading, writing, and storage of a data bit on an ASIC chip. The DRAM cell includes a first transistor acting as a pass gate and having a first source node, a first gate node, and a first drain node. The DRAM cell also includes a second transistor acting as a storage device and having a second drain node that is electrically connected to the first drain node to form a storage node. The second transistor also includes a second source node and a second gate node. The second source node is electrically floating, thus increasing the effective storage capacitance of the storage node.

BACKGROUND OF THE INVENTION

Certain embodiments of the present invention afford an efficientapproach for using a compact DRAM cell to reduce the leakage currentwhen storing a data bit in the DRAM cell. In particular, certainembodiments provide a compact DRAM cell having a storage node formed byelectrically connecting the drain nodes of two transistors in the DRAMcell.

Dynamic RAM is a type of memory that keeps its contents only if suppliedwith regular clock pulses and a chance to periodically refresh thestored data internally. DRAM is much less expensive than static RAM(which needs no refreshing) and is the type found in most personalcomputers and other digital applications

DRAM storage cells may be formed from two elements, usually a transistorand a capacitor. A major reduction in storage cell area is achieved withsuch a configuration. As a result, DRAM is an attractive option forcustom and semi-custom chips.

Highly integrated System-on-Chip (SOC) implementations require highdensity and efficient embedded memory. Embedded DRAM memory has thepotential to offer high density, low power, and high speed required forstate-of-the-art chip designs. Costs associated with integratingembedded DRAM remain a significant factor that slows the integration andadoption of DRAM memory for a wide range of applications includingnext-generation handsets and high-speed networking.

A DRAM cell configuration having high storage capacity and low leakagecurrent that uses generic fabrication processes, requiring no additionalmasks, is desired. Reducing leakage current maximizes retention timewhich means reducing the number of times per second a data bit needs tobe refreshed in a storage node so the data bit is not lost. The moreoften the data bits must be refreshed, the higher the required power andthe less the dependability of the data bits.

Further limitations and disadvantages of conventional and traditionalapproaches will become apparent to one of skill in the art, throughcomparison of such systems with embodiments of the present invention asset forth in the remainder of the present application with reference tothe drawings.

BRIEF SUMMARY OF THE INVENTION

An embodiment of the present invention provides a compact and highlyefficient DRAM cell configuration embedded on an ASIC chip. The DRAMcell provides reading, writing, and storage of a data bit on an ASICchip. The DRAM cell includes a first transistor acting as a pass gateand having a first source node, a first gate node, and a first drainnode. The DRAM cell also includes a second transistor acting as astorage device and having a second drain node that is electricallyconnected to the first drain node to form a storage node. The secondtransistor also includes a second source node and a second gate node.The second source node is electrically floating, thus increasing theeffective storage capacitance of the storage node.

A method of the present invention provides the highly efficient use of acompact DRAM cell configuration by reducing leakage current when storinga data bit in the DRAM cell. The method includes writing a data bit tothe DRAM cell during a first time segment and storing the data bitduring a second time segment. During the second time segment, atransistor disabling reference ground potential is applied to a firstgate node of a first transistor of the DRAM cell. A first referencevoltage is also applied to a first source node of the first transistorduring the second time segment. A second reference voltage is applied toa second gate node of a second transistor during at least a portion ofthe second time segment. The second reference voltage is more positivethan the first reference voltage. The second source node is electricallyfloating to increase the effective storage capacitance of the storagenode of the DRAM cell.

Certain embodiments of the present invention afford an efficientapproach for using a compact DRAM cell to reduce the leakage currentwhen storing a data bit in the DRAM cell.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic block diagram of a DRAM cell configuration inaccordance with an embodiment of the present invention

FIG. 1A illustrates a two-cell layout of the DRAM cell configuration ofFIG. 1 in accordance with an embodiment of the present invention.

FIG. 2 is an exemplary timing diagram illustrating a write time segmentfollowed by a store time segment in accordance with an embodiment of thepresent invention.

FIG. 3 is a schematic block diagram illustrating an undesirableread/write state and resultant high leakage storage state of the DRAMcell configuration of FIG. 1.

FIG. 4 is a schematic block diagram illustrating a first method ofwriting to the DRAM cell configuration of FIG. 1 and storing a data bitin accordance with an embodiment of the present invention.

FIG. 5 is a schematic block diagram illustrating a second method ofwriting to the DRAM cell configuration of FIG. 1 and storing a data bitin accordance with an embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 is a schematic block diagram of a DRAM cell configuration 5 inaccordance with an embodiment of the present invention. The DRAM cell 5includes a pass transistor 10 and a storage transistor 20. The passtransistor 10 acts as a pass gate to enable reading and writing of adata bit. A data bit line 14 connects to the source node 11 of the passtransistor 10. A read/write enable line connects to the gate node 12 ofthe pass transistor 10.

A storage node 100 is formed by the connection of the drain node 13 ofthe pass transistor 10 and the drain node 21 of the storage transistor20. A bias voltage is applied to the gate node 22 of the storagetransistor 20. The source node 23 of the storage transistor 20 is leftfloating. The capacitance associated with the storage transistor 20allows the storage transistor 20 to act as a storage device for a databit.

By sharing the drain nodes between the pass transistor 10 and thestorage transistor 20, the space available for the storage node may beincreased when the DRAM cell is implemented on a chip using embeddedCMOS technology. As a result, the effective storage capacitance isincreased. FIG. 1A illustrates a two-cell layout of the DRAM cellconfiguration of FIG. 1 in accordance with an embodiment of the presentinvention.

The pass transistor 10 and the storage transistor 20 arefield-effect-transistors (FETs). The capacitance provided by the storageFET 20 is due to a junction capacitance of the storage FET 20 and anoxide layer of the floating source node of the storage FET 20. The twocapacitances create an effective storage node capacitance that is usedto store a data bit. The sharing of the diffusion of the drain nodes ofthe two FETs on a CMOS chip allows the effective storage capacitance tobe increased.

FIG. 2 is an exemplary timing diagram illustrating a write time segment30 followed by a store time segment 40 in accordance with an embodimentof the present invention. During the write time segment 30, a data bitis written to the storage node 100 of the DRAM cell. Writing of the databit is accomplished by applying a data bit voltage to the source node 14of the pass FET 10. A read/write-enabling voltage is applied to the gatenode 12 of the pass FET 10. A bias voltage of the same level as theread/write voltage is applied to the gate node 22 of the storage FET 20.

During the store time segment 40, the gate node 12 is brought to anelectrical ground potential to turn off the pass gate 10 after the writetime segment when the storage node is charged up. The data bit line 14is put at a voltage reference level of V_(DD). A bias voltage is appliedto gate node 22 of the storage FET 20 during the store time segment.

During the store time segment 40, a leakage current develops within thecell 5 due to the flow of current from the V_(DD) potential of the databit line 14 to the potential of the storage node 100. When the data bitstored at storage node 100 is a logic “1”, the voltage stored at node100 is at or very near the V_(DD) potential. As a result, the potentialdifference between data bit line 14 and the storage node 100 is smalland the leakage current is small and does not significantly affect thestored potential at storage node 100.

However, when the data bit stored is a logic “0”, the leakage current issignificantly higher and may charge up the storage node toward a logic“1” potential much more quickly after the logic “0” is written to thecell. For example, when the bias voltage applied to gate node 22 isV_(DD) during the store time segment 40 and a logic “0” (zero volts) isbeing stored at storage node 100, then the leakage current between thedata bit line 14 and the storage node 100 may cause the logic “0”potential to charge up to a logic “1” potential in about 1 microsecond.As a result, the logic “0” would have to be written again to the cell,or refreshed, within the 1 microsecond time interval.

FIG. 3 illustrates the case where V_(DD) 60 is applied to gate node 22during both the write time segment 30 and the store time segment 40.During the write time segment (read/write state of the cell) a voltagelevel of V_(DD) 60 is applied to gate node 12 to enable pass FET 10. Thelogic “0” potential of zero volts 70 on data bit line 14 is written tostorage node 100. Once the logic “0” is written to the cell, the logic“0” potential is stored by disabling the pass FET 10 by applying aground reference potential V_(SS) 50 of zero volts to the gate node 12.A reference potential of V_(DD) 60 is applied to data bit line 14. Thepotential difference between the data bit line 14 and the storage node100 is then V_(DD) 60 and the potential difference between the gate node12 and the storage node 100 is zero. Since the gate node 22 is still atV_(DD) 60, the storage node 100 tends to charge up quickly, in about 1microsecond, to a logic “1”, V_(DD), due to the leakage current throughthe cell.

FIG. 4 illustrates a method, according to an embodiment of the presentinvention, to increase the time it takes to charge up the storage nodeby a factor of about 100, thus reducing the frequency of updating orrefreshing the storage node when storing a logic “0”. During the writetime segment 30 (read/write state), a read/write enabling voltage V_(PP)80, which is more positive than V_(DD) 60, is applied to the gate node12 of pass FET 10. The gate node 22 is also at V_(PP) 80 during thewrite time segment 30 and is kept at V_(PP) during the store timesegment 40. The data bit line 14 is again at V_(DD) during the storetime segment 40. As a result, the voltage stored at the storage node 100is (V_(PP)−V_(DD)) and is greater than zero since V_(PP) is greater thanV_(DD). Therefore, the potential difference between the data bit line 14and the storage node 100 is (V_(DD)−(V_(PP)−V_(DD))) which is less thanit was in the previous case.

The leakage current is reduced as a result of the higher potential ofthe storage node 100. Instead of the storage node 100 charging up to alogic “1” in about 1 microsecond, it may now take about 100 microsecondswhen (V_(PP)−V_(DD)) is 200 millivolts. Again, the gate node 12 is at areference ground potential V_(SS) 50 of zero volts during store timesegment 40. The voltage between the gate node 12 and the storage node100 is −(V_(PP)−V_(DD)) 90.

As one possible alternative, instead of keeping the gate node 22 atV_(PP) 80, the gate node 22 may be at V_(DD) 60 during the write timesegment 30 and pulsed to V_(PP) during the store time segment 40 asillustrated in FIG. 5. A voltage driver 25 is used to provide thevoltage pulse from V_(DD) to V_(PP) on gate node 22 during the storetime segment 40. During the write time segment 30, the pass FET 10 isturned on by a read/write voltage which is at a voltage potential ofV_(DD) 60. After the data bit voltage 70 is written to the storage node100, the voltage driver 25 pulses the node gate 22 from V_(DD) to V_(PP)to create a storage node potential of (V_(PP)−V_(DD)). As a result, theleakage current is reduced similarly to the case shown in FIG. 4 and thecharge time is again extended to about 100 microseconds from 1microsecond when (V_(PP)−V_(DD)) is 200 millivolts.

Applying a constant potential of V_(PP) 80 during the write time segmentand store time segment is easier to implement and does not require avoltage driver 25. However, using the voltage driver 25 and pulsing thegate node 22 allows finer control of the leakage current and, therefore,the frequency of storage node updates required.

The various elements of the DRAM cell 5 may be combined or separatedaccording to various embodiments of the present invention. For example,the storage FET 20 and the voltage driver 25 may be integrated as asingle embedded device or may be implemented as two separate embeddeddevices that are electrically connected through an embedded trace.

In summary, certain embodiments of the present invention afford anapproach to obtain system on chip (SOC) integration of high density andefficient embedded memories. Embedded DRAM memories offer high density,low power and high speed required for state-of-the-art chip designs.Leakage currents of embedded DRAM cells are also reduced, increasingmemory storage efficiency.

While the invention has been described with reference to certainembodiments, it will be understood by those skilled in the art thatvarious changes may be made and equivalents may be substituted withoutdeparting from the scope of the invention. In addition, manymodifications may be made to adapt a particular situation or material tothe teachings of the invention without departing from its scope.Therefore, it is intended that the invention not be limited to theparticular embodiment disclosed, but that the invention will include allembodiments falling within the scope of the appended claims.

1-23. (canceled)
 24. A memory cell providing reading, writing, andstorage of a data bit, said cell comprising: a first transistor thatenables reading and writing of said data bit; and a second transistorthat enables storage of said data bit, wherein said first transistor iselectrically connected to said second transistor.
 25. The memory cell ofclaim 24 further comprising: said first transistor having a first sourcenode, a first gate node, and a first drain node; and said secondtransistor having a second drain node that is electrically connected tosaid first drain node, a second source node, and a second gate node. 26.The memory cell of claim 25 wherein said second gate node is connectedto a bias voltage level.
 27. The memory cell of claim 25 wherein saidfirst drain node and said second drain node, connected together,constitute a storage node.
 28. The memory cell of claim 25 furthercomprising a pulsed voltage driver connected to said second gate node.29. The memory cell of claim 25 wherein said first gate node comprises amemory read/write-enable line.
 30. The memory cell of claim 25 whereinsaid first source node comprises a memory bit line that is written toand read from.
 31. The memory cell of claim 24 wherein said firsttransistor is a field-effect-transistor (FET).
 32. The memory cell ofclaim 24 wherein said second transistor is a FET.
 33. The memory cell ofclaim 24 wherein said second transistor has a first storage capacitanceassociated with a junction of said second transistor.
 34. The memorycell of claim 24 wherein said second transistor has a second storagecapacitance associated with an oxide layer of said second source node tostore said data bit.